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Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant
Product Details:
| Place of Origin: | China |
| Brand Name: | BonTek |
| Certification: | ISO:9001 |
| Model Number: | Sapphire (Al2O3) |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 Pieces |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Cassette, Jar, Film package |
| Delivery Time: | 1-4 weeks |
| Payment Terms: | T/T |
| Supply Ability: | 10000 pieces/Month |
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Detail Information |
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| Material: | Sapphire Windows | Growth: | Kyropoulos Method |
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| Melting Point: | 2040 °C | Thermal Conductivity: | 27.21 W/(m X K) At 300 K |
| Thermal Expansion: | 5.6 X 10 -6 /K (parallel C-axis) & 5.0 (perpendicular C-axis) X 10 -6 /K | Hardness: | Knoop 2000 Kg/mm 2 With 2000g Indenter |
| Specific Heat Capacity: | 419 J/(kg X K) | Dielectric Constant: | 11.5 (parallel C-axis) 9.4 (perpendicular C-axis) At 1MHz |
| Highlight: | Semiconductor Piezoelectric Wafer,Sapphire Windows Piezoelectric Wafer,Scratching Resistant Sapphire Wafer |
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Product Description
Semiconductor Sapphire Wafer Sapphire Windows Piezoelectric Wafer
Sapphire is a material of a unique combination of physical, chemical and optical properties, which make it resistant to high temperature, thermal shock, water and sand erosion, and scratching. It is a superior window material for many IR applications from 3µm to 5µm. C-plane sapphire substrates are widely used to grow III-V and II-VI compounds such as GaN for blue LED and laser diodes, while R-plane sapphire substrates are used for the hetero-epitaxial deposition of silicon for microelectronic IC applications.
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Item |
3-inch C-plane(0001) 500μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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Grade |
Prime, Epi-Ready |
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Surface Orientation |
C-plane(0001) |
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C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
76.2 mm +/- 0.1 mm |
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Thickness |
500 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
22.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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TTV |
< 15 μm |
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BOW |
< 15 μm |
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WARP |
< 15 μm |
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Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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25 pieces in one cassette packaging or single piece packaging. |
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Item |
4-inch C-plane(0001) 650μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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Grade |
Prime, Epi-Ready |
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Surface Orientation |
C-plane(0001) |
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C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
100.0 mm +/- 0.1 mm |
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Thickness |
650 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
30.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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TTV |
< 20 μm |
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BOW |
< 20 μm |
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WARP |
< 20 μm |
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Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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25 pieces in one cassette packaging or single piece packaging. |
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Item |
6-inch C-plane(0001) 1300μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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|
Grade |
Prime, Epi-Ready |
|
|
Surface Orientation |
C-plane(0001) |
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|
C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
150.0 mm +/- 0.2 mm |
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Thickness |
1300 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
47.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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TTV |
< 25 μm |
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BOW |
< 25 μm |
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WARP |
< 25 μm |
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|
Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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|
25 pieces in one cassette packaging or single piece packaging. |
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